Industries with large target consumption mainly include semiconductor integrated circuits, flat panel displays, solar cells, magnetic recording media, optical devices, etc. (these are classified by application). Among them, high-purity sputtering targets are mainly used in fields requiring higher material purity and stability, such as semiconductors, flat panel displays, solar cells, magnetic recording media, etc.

　　In all applications, semiconductors have high technical requirements and purity for sputtering targets, and the price is also expensive. The requirements in this regard are significantly higher than those in flat panel displays, solar cells and other application fields. Semiconductor chips set strict standards for the purity of metal materials and internal microstructure of sputtering targets. If the impurity content of sputtering targets is too high, the formed films cannot meet the electrical properties required for use, and particles are easy to form on the wafer during sputtering, resulting in circuit short circuit or damage, which will seriously affect the performance of the films.

　　Chip manufacturing requires high metal purity of sputtering target, usually more than 99.9995%, while flat panel display and solar cell are required to reach more than 99.999% and 99.995% respectively.

　　In addition to purity, the chip also sets strict standards for the internal microstructure of sputtering target. It is necessary to master the key technologies in the production process and make products that meet the process requirements after long-term practice.

　　Ultra high purity metal and sputtering target are important components of electronic materials. The sputtering target industry chain mainly includes metal purification, target manufacturing, sputtering coating and terminal application. Among them, target manufacturing and sputtering coating are the key links in the whole sputtering target industry chain.