China's target industry urgently needs to break through the bottleneck of talents and technology

　　With the continuous development of integrated circuit manufacturing technology, higher and higher requirements are put forward for the quality of targets both in micro quality and macro specification. The micronization of integrated circuit manufacturing process and the diversification of thin film materials for sputtering require that the target not only has high purity and uniform composition, but also mainly reflects the strict requirements of target density, grain size, texture, conductivity and bonding strength; At the same time, with the gradual increase of wafer size, the required target size also increases, which poses challenges in the control of microstructure and performance uniformity of large-size materials and high-precision molding; In addition, in order to further improve the performance of the target, the structure of the target needs to be optimized. This undoubtedly poses new and higher challenges to domestic target enterprises.

　　Although the rapid development of China's integrated circuit, flat panel display, solar cell and other industries in recent years has gradually made China one of the regions with large demand for thin film targets in the world, it is undeniable that ultra-high purity sputtering targets still need to be imported from abroad.

　　Due to the late start of the domestic ultra-high purity sputtering target industry and the limitations of technology, capital and talents, the number of domestic enterprises specializing in ultra-high purity sputtering targets is relatively small, and the enterprise scale and technical level are uneven. Most domestic enterprises are in the state of small enterprise scale, low technical level and scattered industrial layout, and the market is still in the early stage of development, It mainly focuses on the competition in the field of low-end products. He pointed out that in the face of fierce international competition, the lack of professionals in the sputtering target industry has become a pain point restricting the development of the domestic target industry. "The target development is mainly carried out in the enterprise. In order to gain an advantage in the competition, the target companies are highly confidential, so the industry is highly specialized, and the selection of talents is limited to a few target companies. Universities and scientific research institutes carry out less basic research and Application Research on sputtering targets, the time is short, and the research intensity is not as large as that of target companies, so the training is not enough There is a slight shortage of talents, both in quantity and level, "Yao Lijun said. He also pointed out that with the transfer of global manufacturing centers to China, foreign target suppliers, taking into account the factors of price and delivery time, hope to realize localized supply. Therefore, they have established processing plants in China, which undoubtedly makes the competition faced by the domestic target industry more intense. "In addition, major breakthroughs need to be made in the preparation of raw materials for ultra-high purity sputtering targets in China, and problems such as quality consistency of raw materials and key technologies also need to be solved," Yao Lijun told reporters.

　　Taking tantalum target as an example, this paper analyzes the common problems in the industry. The technical and industrial chain barriers formed by foreign peers cause technical obstacles and traps for the localization of tantalum target, and can not form a feedback mechanism. At the same time, the tantalum target products of foreign peers have mature and stable technology and cost advantages, while tantalum targets are in the initial stage in China, with high production cost and no cost advantage to enter the market.